• DocumentCode
    881050
  • Title

    Therhionic Integrated Circuits: Electronics for Hostile Environments

  • Author

    Lynn, D.K. ; McCormick, J.B. ; MacRoberts, M.D.J. ; Wilde, D.K. ; Dooley, G.R. ; Brown, D.R.

  • Author_Institution
    Electronics Division Los Alamos National Laboratory Los Alamos, NM 87545
  • Volume
    32
  • Issue
    6
  • fYear
    1985
  • Firstpage
    3996
  • Lastpage
    4000
  • Abstract
    Thermionic integrated circuits (TICs) combine thermionic emission of vacuum tube technology with the thin-film deposition and photolithographic delineation techniques of conventional silicon integrated circuits to form microminiature-integrated vacuum triode circuits. The resulting integrated circuits are extremely tolerant to both high-radiation and high-temperature environments.
  • Keywords
    Anodes; Bonding; Cathodes; Circuit testing; Electrodes; Electron emission; Substrates; Thermionic emission; Titanium; Voltage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1985.4334057
  • Filename
    4334057
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=881050