Title :
A compact low-loss reconfigurable monolithic low-pass filter using multiple-contact MEMS switches
Author :
Lee, Sanghyo ; Park, Jae-Hyoung ; Kim, Jung-Mu ; Kim, Hong-Teuk ; Kim, Yong-Kweon ; Kwon, Youngwoo
Author_Institution :
Sch. of Electr. Eng., Center for 3-D Millimeter-Wave Integrated Syst., Seoul, South Korea
Abstract :
A high-performance reconfigurable low-pass filter based on the quasifractal self-similar structures has been developed at millimeter-waves using multiple-contact MEMS switches. Three-cell cascaded low-pass structure was reconfigured to one-cell low-pass counterpart by activating the micromachined switches to achieve 3:1 frequency scaling. Two types of special multiple-contact MEMS switches were developed to reduce the number of switching elements as well as to reduce the insertion loss and, thus, extend the operating frequencies to mm-waves. In addition, bias-decoupling circuits were eliminated, resulting in a small chip size of 1.2 mm × 1.5 mm. The measured 3-dB cut-off frequency of the reconfigurable low-pass filter changed from 67 GHz to 28 GHz with minor change in the insertion loss from 0.32 dB to 0.27 dB. This work demonstrates the possibility of high-performance compact-size reconfigurable filters at mm-waves using multiple-contact micromachined switches.
Keywords :
MIMIC; integrated circuit layout; low-pass filters; microswitches; millimetre wave filters; 0.27 to 0.32 dB; 28 to 67 GHz; bias-decoupling circuits; cut-off frequency; frequency scaling; insertion loss; low-loss reconfigurable monolithic low-pass filter; millimeter-waves; multiple-contact micromachined switches; operating frequencies; quasifractal self-similar structures; reconfigurable filters; small chip; special multiple-contact MEMS switches; switching elements; three-cell cascaded low-pass structure; Band pass filters; Frequency; Insertion loss; Low pass filters; Micromechanical devices; Microswitches; Millimeter wave technology; P-i-n diodes; Switches; Switching circuits;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2003.819963