Title :
Characteristics of aligned carbon nanofibers for interconnect via applications
Author :
Ngo, Quoc ; Cassell, Alan M. ; Austin, Alexander J. ; Li, Jun ; Krishnan, Shoba ; Meyyappan, M. ; Yang, Cary Y.
Author_Institution :
Center for Nanostruct., Santa Clara Univ., Moffet Field, CA, USA
fDate :
4/1/2006 12:00:00 AM
Abstract :
Electrical properties of plasma-enhanced chemical vapor deposited carbon nanofibers (CNFs) are characterized with measurements over a broad temperature range (4-300 K). Temperature-dependent measurements of CNF via resistivity reveal a behavior resembling the mixture of graphite a-axis and c-axis transport mechanisms. For the first time, temperature-dependent characteristics of CNFs are measured and modeled based on previously developed models for electron conduction in graphite. Reliability measurements are performed to demonstrate the robust electrical and thermal properties of CNF vias for next-generation on-chip-interconnect designs.
Keywords :
carbon fibres; electrical conductivity; fullerenes; graphite; nanostructured materials; plasma CVD coatings; reliability; 4 to 300 K; carbon nanofibers; electrical properties; electron conduction; graphite a-axis transport mechanism; graphite c-axis transport mechanism; on-chip-interconnect design; plasma-enhanced chemical vapor deposition; reliability measurements; thermal properties; Chemicals; Electric variables measurement; Mechanical factors; Plasma applications; Plasma chemistry; Plasma measurements; Plasma properties; Plasma temperature; Plasma transport processes; Temperature distribution; Carbon nanofiber (CNF); interconnect; via;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2006.870865
