DocumentCode
882073
Title
A new junction termination method employing shallow trenches filled with oxide
Author
Oh, Jae-Keun ; Ha, Min-Woo ; Han, Min-Koo ; Choi, Yearn-Ik
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Volume
25
Issue
1
fYear
2004
Firstpage
16
Lastpage
18
Abstract
A new junction termination method employing shallow trenches filled with oxide, which successfully decreased the junction termination area, is proposed and fabricated without any complicated process such as Si-deep etching. Shallow trenches between the floating field limiting rings successfully redistributed the single electric field peak into two peaks so that the breakdown voltage could be increased with the same junction termination area. The experimental results show that the proposed method decreased the junction termination area by more than 25% compared to a conventional field limiting ring structure when breakdown voltages are equal.
Keywords
etching; semiconductor device breakdown; semiconductor junctions; silicon compounds; Si; breakdown voltage; deep etching; electric field peak; junction termination method; oxide; shallow trenches; Electric breakdown; Etching; Fabrication; Helium; Insulated gate bipolar transistors; MOSFETs; P-n junctions; Silicon; Termination of employment; Voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2003.821599
Filename
1264100
Link To Document