• DocumentCode
    882073
  • Title

    A new junction termination method employing shallow trenches filled with oxide

  • Author

    Oh, Jae-Keun ; Ha, Min-Woo ; Han, Min-Koo ; Choi, Yearn-Ik

  • Author_Institution
    Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
  • Volume
    25
  • Issue
    1
  • fYear
    2004
  • Firstpage
    16
  • Lastpage
    18
  • Abstract
    A new junction termination method employing shallow trenches filled with oxide, which successfully decreased the junction termination area, is proposed and fabricated without any complicated process such as Si-deep etching. Shallow trenches between the floating field limiting rings successfully redistributed the single electric field peak into two peaks so that the breakdown voltage could be increased with the same junction termination area. The experimental results show that the proposed method decreased the junction termination area by more than 25% compared to a conventional field limiting ring structure when breakdown voltages are equal.
  • Keywords
    etching; semiconductor device breakdown; semiconductor junctions; silicon compounds; Si; breakdown voltage; deep etching; electric field peak; junction termination method; oxide; shallow trenches; Electric breakdown; Etching; Fabrication; Helium; Insulated gate bipolar transistors; MOSFETs; P-n junctions; Silicon; Termination of employment; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2003.821599
  • Filename
    1264100