DocumentCode :
882073
Title :
A new junction termination method employing shallow trenches filled with oxide
Author :
Oh, Jae-Keun ; Ha, Min-Woo ; Han, Min-Koo ; Choi, Yearn-Ik
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Volume :
25
Issue :
1
fYear :
2004
Firstpage :
16
Lastpage :
18
Abstract :
A new junction termination method employing shallow trenches filled with oxide, which successfully decreased the junction termination area, is proposed and fabricated without any complicated process such as Si-deep etching. Shallow trenches between the floating field limiting rings successfully redistributed the single electric field peak into two peaks so that the breakdown voltage could be increased with the same junction termination area. The experimental results show that the proposed method decreased the junction termination area by more than 25% compared to a conventional field limiting ring structure when breakdown voltages are equal.
Keywords :
etching; semiconductor device breakdown; semiconductor junctions; silicon compounds; Si; breakdown voltage; deep etching; electric field peak; junction termination method; oxide; shallow trenches; Electric breakdown; Etching; Fabrication; Helium; Insulated gate bipolar transistors; MOSFETs; P-n junctions; Silicon; Termination of employment; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2003.821599
Filename :
1264100
Link To Document :
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