DocumentCode :
882183
Title :
High-performance single polysilicon EEPROM with stacked MIM capacitor
Author :
Kee-Yeol Na ; Yeong-Seuk Kim
Author_Institution :
Dept. of Semicond. Eng., Chungbuk Nat. Univ., Cheongju, South Korea
Volume :
27
Issue :
4
fYear :
2006
fDate :
4/1/2006 12:00:00 AM
Firstpage :
294
Lastpage :
296
Abstract :
High-performance single polysilicon electrically erasable programmable read-only memories (EEPROMs) with stacked metal-insulator-metal capacitor as a control gate are investigated. The thickness of the tunnel oxide and the length of the floating gate channel of the fabricated devices were 52 /spl Aring/ and 0.24 μm, respectively. The effective control gate coupling ratio of the proposed EEPROM cell was higher than that of cells with n-well control gate because of the absence of depletion capacitance in the n-well silicon region. The experimental results showed that the program speed of the proposed cells were faster than those of the conventional n-well control gate cells. In addition, the proposed cells had threshold voltage shifts of 3.5 V between program and erase states. Furthermore, there were threshold voltage shifts of 3.0 V without degradation of the read currents after 1000 program/erase cycles.
Keywords :
EPROM; MIM devices; capacitors; elemental semiconductors; silicon; 0.24 micron; 3.0 V; 3.5 V; 52 /spl Aring/; EEPROM cells; Fowler-Nordheim tunneling; MIM capacitor; Si; channel hot electron; electrically erasable programmable read-only memories; floating gate channel; gate coupling ratio; metal-insulator-metal capacitor; nonvolatile memory; single polysilicon EEPROM memory; threshold voltage shifts; tunnel oxide; Capacitance; Character generation; EPROM; Logic devices; MIM capacitors; Nonvolatile memory; PROM; Radiofrequency identification; Silicon; Threshold voltage; Channel hot electron; Fowler–Nordheim (FN) tunneling; metal–insulator–metal (MIM) capacitor; nonvolatile memory (NVM); single polysilicon electrically erasable programmable read-only memory (EEPROM); standard logic process;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2006.871838
Filename :
1610790
Link To Document :
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