DocumentCode
882935
Title
Computer simulation of integrated circuits in the presence of electrothermal interaction
Author
Fukahori, Kiyoshi ; Gray, Paul R.
Volume
11
Issue
6
fYear
1976
fDate
12/1/1976 12:00:00 AM
Firstpage
834
Lastpage
846
Abstract
A computer program which predicts the DC and transient performance of monolithic integrated circuits in the presence of electrothermal interactions on the integrated circuit die is described. The thermal modeling of the die/package structure and the numerical analysis procedure is discussed. Experimental and simulation results are compared for monolithic operational amplifiers, voltage regulators, and a temperature-stabilized voltage reference.
Keywords
Circuit CAD; Circuit analysis computing; Linear integrated circuits; Modelling; Monolithic integrated circuits; Simulation; circuit CAD; circuit analysis computing; linear integrated circuits; modelling; monolithic integrated circuits; simulation; Circuit simulation; Computational modeling; Computer simulation; Electrothermal effects; Integrated circuit packaging; Monolithic integrated circuits; Numerical analysis; Operational amplifiers; Regulators; Voltage;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1976.1050825
Filename
1050825
Link To Document