3D Ultrasonic Rangefinder on a Chip

Author

Przybyla, Richard J. ; Hao-Yen Tang ; Guedes, Andre ; Shelton, Sarah E. ; Horsley, David A. ; Boser, Bernhard E.

Author_Institution

Chirp Microsyst., Inc., Berkeley, CA, USA

Volume

50

Issue

1

fYear

2015

fDate

Jan. 2015

Firstpage

320

Lastpage

334

Abstract

An ultrasonic 3D rangefinder uses an array of AlN MEMS transducers and custom readout electronics to localize targets over a ±45° field of view up to 1 m away. The rms position error at 0.5 m range is 0.4 mm, 0.2 °, and 0.8 ° for the range, x-angle, and y-angle axes, respectively. The 0.18 μm CMOS ASIC comprises 10 independent channels with separate high voltage transmitters, readout amplifiers, and switched-capacitor bandpass ΣΔ ADCs with built-in continuous time anti-alias filtering. For a 1 m maximum range, power dissipation is 400 μW at 30 fps. For a 0.3 m maximum range, the power dissipation scales to 5 μW/ch at 10 fps.

Keywords

CMOS image sensors; amplifiers; analogue-digital conversion; band-pass filters; distance measurement; measurement errors; microsensors; readout electronics; switched capacitor filters; system-on-chip; ultrasonic measurement; ultrasonic transducer arrays; 3D ultrasonic rangefinder; CMOS ASIC; MEMS transducer array; built-in continuous time anti-alias filtering; custom readout electronics; distance 1 m; field of view; high voltage transmitter; readout amplifiers; rms position error; size 0.18 mum; switched capacitor bandpass ΣΔ ADC; target localization; Acoustics; Arrays; Noise; Receivers; Three-dimensional displays; Transducers; Ultrasonic imaging; 3D rangefinding; Bandpass ADCs; CMOS; MEMS; depth sensing; micromachined ultrasound transducers; rangefinding; ultrasound;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/JSSC.2014.2364975

Filename

6982233