Title :
Influence of Si nanocrystal distributed in the gate oxide on the MOS capacitance
Author :
Ng, C.Y. ; Chen, T.P. ; Ding, L. ; Yang, M. ; Wong, J.I. ; Zhao, P. ; Yang, X.H. ; Liu, K.Y. ; Tse, M.S. ; Trigg, A.D. ; Fung, S.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fDate :
4/1/2006 12:00:00 AM
Abstract :
In this paper, the authors have studied the influence of silicon nanocrystal (nc-Si) distributed in the gate oxide on the capacitance for the circumstances that the nc-Si does not form conductive percolation tunneling paths connecting the gate to the substrate. The nc-Si is synthesized by Si-ion implantation. The effective dielectric constant of the gate oxide in the nc-Si distributed region is calculated based on a sublayer model of the nc-Si distribution and the Maxwell-Garnett effective medium approximation. After the depth distribution of the effective dielectric constant is obtained, the MOS capacitance is determined. Two different nc-Si distributions, i.e., partial and full nc-Si distributions in the gate oxide, have been considered. The MOS capacitance obtained from the modeling has been compared to the capacitance measurement for a number of samples with various gate-oxide thicknesses, implantation energies and dosages, and an excellent agreement has been achieved for all the samples. A detailed picture of the influence of implantation energy and implantation dosage on the MOS capacitance has been obtained.
Keywords :
MOS capacitors; elemental semiconductors; ion implantation; nanostructured materials; permittivity; semiconductor device models; silicon; MOS capacitance; Si; capacitance measurement; conductive percolation tunneling paths; dielectric constant; gate oxide thickness; ion implantation; silicon nanocrystal; Annealing; CMOS process; Capacitance measurement; Dielectric constant; Dielectric substrates; Fabrication; Joining processes; Nanocrystals; Silicon; Tunneling; Dielectric constant; MOS capacitance; silicon nanocrystal;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2006.870872