DocumentCode :
886036
Title :
Enhancement-Mode Buried-Channel \\hbox {In}_{0.7} \\hbox {Ga}_{0.3}\\hbox {As/In}_{0.52}\\hbox {Al}_{0.48}\\hbox {As} MOSFETs With High-
Author :
Sun, Yanning ; Kiewra, E.W. ; Koester, S.J. ; Ruiz, N. ; Callegari, A. ; Fogel, K.E. ; Sadana, D.K. ; Fompeyrine, J. ; Webb, D.J. ; Locquet, J.-P. ; Sousa, M. ; Germann, R. ; Shiu, K.T. ; Forrest, S.R.
Author_Institution :
IBM, Yorktown Heights
Volume :
28
Issue :
6
fYear :
2007
fDate :
6/1/2007 12:00:00 AM
Firstpage :
473
Lastpage :
475
Abstract :
The operation of long- and short-channel enhancement-mode In0.7Ga0.3As-channel MOSFETs with high-k gate dielectrics are demonstrated for the first time. The devices utilize an undoped buried-channel design. For a gate length of 5 mum, the long-channel devices have Vt= +0.25 V, a subthreshold slope of 150 mV/dec, an equivalent oxide thickness of 4.4 +/ - 0.3 nm, and a peak effective mobility of 1100 cm2/Vldrs. For a gate length of 260 nm, the short-channel devices have Vt=+0.5 V and a subthreshold slope of 200 mV/dec. Compared with Schottky-gated high-electron-mobility transistor devices, both long- and short-channel MOSFETs have two to four orders of magnitude lower gate leakage.
Keywords :
III-V semiconductors; MOSFET; aluminium compounds; gallium arsenide; high-k dielectric thin films; indium compounds; In0.7Ga0.3As-In0.52Al0.48As; enhancement-mode buried-channel MOSFET; high-k gate dielectrics; long-channel MOSFETs; short-channel MOSFETs; short-channel device; size 260 nm; size 5 mum; undoped buried-channel design; voltage 0.25 V; voltage 0.5 V; Dielectrics; HEMTs; Indium gallium arsenide; Indium phosphide; Logic devices; MODFETs; MOSFETs; Molecular beam epitaxial growth; Sun; Ultra large scale integration; Buried channel; InGaAs; MOSFET; enhancement mode; high- $kappa$;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2007.896813
Filename :
4212190
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