• DocumentCode
    886670
  • Title

    1 /spl mu/m MOSFET VLSI technology. VIII. Radiation effects

  • Author

    Aitken, John M.

  • Volume
    14
  • Issue
    2
  • fYear
    1979
  • fDate
    4/1/1979 12:00:00 AM
  • Firstpage
    294
  • Lastpage
    301
  • Abstract
    For pt.VII see ibid., vol.SC14, no.2, p.291 (1979). The effect of electron-beam radiation on polysilicon-gate MOSFETs is examined. The irradiations were performed at 25 kV in a vector scan electron-beam lithography system at dosages typical of those used to expose electron-beam resists. Two types of studies are reported. In the first type, devices fabricated with optical lithography were exposed to blanket electron-beam radiation after fabrication. In the second, discrete devices from a test chip, fabricated entirely with electron-beam lithography, were used.
  • Keywords
    Electron beam effects; Electron beam lithography; Field effect integrated circuits; Integrated circuit technology; Large scale integration; electron beam effects; electron beam lithography; field effect integrated circuits; integrated circuit technology; large scale integration; Annealing; Electron traps; Lithography; MOSFET circuits; Optical device fabrication; Optical devices; Optical scattering; Radiation effects; Temperature; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1979.1051177
  • Filename
    1051177