DocumentCode
886670
Title
1 /spl mu/m MOSFET VLSI technology. VIII. Radiation effects
Author
Aitken, John M.
Volume
14
Issue
2
fYear
1979
fDate
4/1/1979 12:00:00 AM
Firstpage
294
Lastpage
301
Abstract
For pt.VII see ibid., vol.SC14, no.2, p.291 (1979). The effect of electron-beam radiation on polysilicon-gate MOSFETs is examined. The irradiations were performed at 25 kV in a vector scan electron-beam lithography system at dosages typical of those used to expose electron-beam resists. Two types of studies are reported. In the first type, devices fabricated with optical lithography were exposed to blanket electron-beam radiation after fabrication. In the second, discrete devices from a test chip, fabricated entirely with electron-beam lithography, were used.
Keywords
Electron beam effects; Electron beam lithography; Field effect integrated circuits; Integrated circuit technology; Large scale integration; electron beam effects; electron beam lithography; field effect integrated circuits; integrated circuit technology; large scale integration; Annealing; Electron traps; Lithography; MOSFET circuits; Optical device fabrication; Optical devices; Optical scattering; Radiation effects; Temperature; Very large scale integration;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1979.1051177
Filename
1051177
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