DocumentCode :
886851
Title :
Model and performance of hot-electron MOS transistors for VLSI
Author :
Hoefflinger, Bernd ; Sibbert, Hans ; Zimmer, GÜnter
Volume :
14
Issue :
2
fYear :
1979
fDate :
4/1/1979 12:00:00 AM
Firstpage :
435
Lastpage :
442
Abstract :
On the basis of a hyperbolic velocity-field characteristic, a powerful nonlinear analytical model both for conductive and capacitive contributions is presented, which covers the triode and saturation regions continuously. The crucial parameter is the pinch-off field E/SUB G/, for which a sensitive measurement technique is described. Static and dynamic simulations are in good agreement with 2-μm transistors and circuits, self-aligned by ion implantation. Expressions are developed for transistor transconductance, output resistance, available voltage gain, and effective input capacitance as well as inverter supply voltage, threshold voltages, ratio, noise margin, power dissipation, and delay time. These quantities are in terms of the characteristic product of channel length L and pinch-off field E/SUB G/ so that the effects of scaling into the submicron regime can be predicted as demonstrated by the design parameter set for a 5-fJ inverter with a 0.5-μm HEMOS driver transistor.
Keywords :
Field effect integrated circuits; Hot carriers; Integrated circuit technology; Large scale integration; Semiconductor device models; field effect integrated circuits; hot carriers; integrated circuit technology; large scale integration; semiconductor device models; Analytical models; Circuit simulation; Dynamic voltage scaling; Inverters; Ion implantation; MOSFETs; Measurement techniques; Threshold voltage; Transconductance; Very large scale integration;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1979.1051195
Filename :
1051195
Link To Document :
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