Title :
Electron-beam testing of VLSI circuits
Author :
Wolfgang, Eckhard ; Fazekas, Peter ; Feuerbaum, Hans-Peter ; Lindner, Rudolf
fDate :
4/1/1979 12:00:00 AM
Abstract :
The electron probe is both nonloading and nondestructive and can be used not only for quantitative waveform measurements on an IC but also for obtaining images of the logical states of relatively large portions of its circuit configuration. Since each type of configuration calls for a separate measuring technique, six different techniques are treated and their application and equipment needs described. The state of the art of electron-beam testing is demonstrated with reference to three typical applications, viz., checking a decoding scheme, measuring the sense signal (approximately 300 mV) of a 16-kbit MOS RAM and checking the operation of the timing circuitry of a 4-bit microprocessor. The present applicational limitations and future perspectives of electron-beam testing are discussed.
Keywords :
Electron beam applications; Electron probe analysis; Field effect integrated circuits; Integrated circuit testing; Large scale integration; Microprocessor chips; Random-access storage; Test equipment; electron beam applications; electron probe analysis; field effect integrated circuits; integrated circuit testing; large scale integration; microprocessor chips; random-access storage; test equipment; Capacitance; Circuit testing; Electric variables measurement; Integrated circuit measurements; Packaging; Probes; Scanning electron microscopy; System testing; Very large scale integration; Voltage;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1979.1051199