Hermetic sealing process with atmospheric pressure vibration for LSI packages

Author

Fujita, Yuuji ; Kokuda, Masahide ; Mizuishi, Ken´Ichi

Author_Institution

Hitachi Ltd., Tokyo, Japan

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

714

Lastpage

717

Abstract

The authors present a hermetic soldering technique, the atmospheric pressure vibration (APV) process, which periodically changes the ambient pressure while the solder is fused at the sealing area of the LSI package. The kinetic energy induced by the ambient pressure change improves the wettability of the fused solder, which results in realizing a good hermeticity of the sealing area without mechanically handling the package. The sealing apparatus is made to control the two key parameters of the kinetic energy, the amplitude and the rise time of the ambient pressure change. The mechanism of this process to improve the hermeticity is investigated with a soft X-ray micrograph analysis for the sealed packages

Keywords

X-ray diffraction examination of materials; integrated circuit technology; large scale integration; packaging; seals (stoppers); soldering; LSI packages; ambient pressure change; atmospheric pressure vibration; fused solder wettability; hermetic soldering technique; kinetic energy; sealing area; soft X-ray micrograph analysis; Assembly; Delay; Integrated circuit interconnections; Kinetic energy; Large scale integration; Oxidation; Packaging; Pressure control; Soldering; Vibrations;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105122

Filename

105122