The design of the ES/9000 module

Author

Davidson, Evan E. ; Hardin, Peter W. ; Katopis, George A. ; Nealon, Michael G. ; Wu, Leon L.

Author_Institution

IBM Gen. Technol. Div., Hopewell Junction, NY, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

744

Lastpage

748

Abstract

The ES/9000 thermal conduction module (TCM) is a significant improvement over the TCMs used in the current IBM 3090 series of mainframes. Included in the features of this module, which supports an order of magnitude increase in usable circuits, are a glass ceramic substrate material, buried engineering change wires, partial thin film redistribution, and on-module decoupling capacitors. The physical attributes and the electrical design considerations are described. The result is a packaged electronic technology that supports a machine cycle time that is approximately two times faster than the original 3090 technology

Keywords

IBM computers; integrated circuit technology; mainframes; modules; packaging; ES/9000 thermal conduction module; IBM 3090 series mainframes; buried engineering change wires; electrical design considerations; glass ceramic substrate material; machine cycle time; on-module decoupling capacitors; packaged electronic technology; partial thin film redistribution; Capacitors; Ceramics; Conducting materials; Electronics packaging; Glass; Packaging machines; Substrates; Thermal conductivity; Thin film circuits; Wires;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105127

Filename

105127