DocumentCode
887771
Title
Combining negative binomial and Weibull distributions for yield and reliability prediction
Author
Barnett, Thomas S. ; Grady, Matt ; Purdy, Kathleen G. ; Singh, Adit D.
Author_Institution
IBM Syst. & Technol. Group, USA
Volume
23
Issue
2
fYear
2006
Firstpage
110
Lastpage
116
Abstract
A key productivity metric in semiconductor manufacturing is wafer test yield - the fraction of dies deemed functional following wafer probe testing. Wafer test yield is directly related to semiconductor manufacturing profitability: The higher the yield, the lower the cost of producing a functional chip, and therefore the greater the potential profit. Because wafer test yield is such a critical variable in a products profit potential, accurate yield projection models are essential to semiconductor manufacturers economic success. It is important to understand the correlation between defects causing yield loss and defects causing reliability failures. This article presents a modeling methodology and supporting data, demonstrating that yield and reliability defects can be directly linked in a unified model.
Keywords
Weibull distribution; binomial distribution; integrated circuit reliability; integrated circuit testing; integrated circuit yield; monolithic integrated circuits; statistical testing; Weibull distributions; negative binomial distribution; reliability failures; reliability prediction; semiconductor manufacturing; wafer test yield; yield prediction; Cost function; Economic forecasting; Probes; Productivity; Profitability; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor device testing; Virtual manufacturing; Weibull distribution; fault tolerance; reliability; testing;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2006.38
Filename
1613790
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