• DocumentCode
    887771
  • Title

    Combining negative binomial and Weibull distributions for yield and reliability prediction

  • Author

    Barnett, Thomas S. ; Grady, Matt ; Purdy, Kathleen G. ; Singh, Adit D.

  • Author_Institution
    IBM Syst. & Technol. Group, USA
  • Volume
    23
  • Issue
    2
  • fYear
    2006
  • Firstpage
    110
  • Lastpage
    116
  • Abstract
    A key productivity metric in semiconductor manufacturing is wafer test yield - the fraction of dies deemed functional following wafer probe testing. Wafer test yield is directly related to semiconductor manufacturing profitability: The higher the yield, the lower the cost of producing a functional chip, and therefore the greater the potential profit. Because wafer test yield is such a critical variable in a products profit potential, accurate yield projection models are essential to semiconductor manufacturers economic success. It is important to understand the correlation between defects causing yield loss and defects causing reliability failures. This article presents a modeling methodology and supporting data, demonstrating that yield and reliability defects can be directly linked in a unified model.
  • Keywords
    Weibull distribution; binomial distribution; integrated circuit reliability; integrated circuit testing; integrated circuit yield; monolithic integrated circuits; statistical testing; Weibull distributions; negative binomial distribution; reliability failures; reliability prediction; semiconductor manufacturing; wafer test yield; yield prediction; Cost function; Economic forecasting; Probes; Productivity; Profitability; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor device testing; Virtual manufacturing; Weibull distribution; fault tolerance; reliability; testing;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2006.38
  • Filename
    1613790