Title :
Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications
Author :
Choi, Jinwoo ; Dong Gun Kam ; Chung, Daehyun ; Srinivasan, Krishna ; Govind, Vinu ; Kim, Joungho ; Swaminathan, Madhavan
Author_Institution :
IBM Syst. & Technol. Group, IBM Corp., Austin, TX
fDate :
5/1/2007 12:00:00 AM
Abstract :
This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems
Keywords :
electromagnetic interference; integrated circuit interconnections; mixed analog-digital integrated circuits; photonic band gap; SONNET; alternating impedance electromagnetic bandgap structure; electromagnetic interference; far-field analyses; full-wave solver; mixed-signal applications; near-field analyses; noise isolation; noise suppression; power distribution network; signal integrity; Analytical models; Electromagnetic analysis; Electromagnetic measurements; Impedance; Noise measurement; Packaging; Periodic structures; Power measurement; Testing; Vehicles; Alternating impedance electromagnetic bandgap (AI-EBG) structure; electromagnetic interference (EMI); far-field (FF); mixed-signal system; near-field (NF); noise isolation; radiation; signal integrity;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.896921
