Title :
Prediction of Losses Caused by Roughness of Metallization in Printed-Circuit Boards
Author :
Deutsch, Alina ; Surovic, Christopher W. ; Krabbenhoft, Roger S. ; Kopcsay, Gerard V. ; Chamberlin, Bruce J.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY
fDate :
5/1/2007 12:00:00 AM
Abstract :
In this paper, the effect of metal roughness on the total loss, the extracted tandelta, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, 2-D, causal, broadband modeling methodology is shown
Keywords :
metallization; printed circuit design; printed circuit manufacture; surface roughness; interconnections; metal roughness; metallization roughness; printed-circuit boards; signal integrity; Attenuation; Dielectric constant; Dielectric losses; Dielectric materials; Frequency; Integrated circuit interconnections; Metallization; Permittivity; Predictive models; Wiring; Characterization of card wiring permittivity; metallization roughness; printed circuit board losses;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.896008
