Title :
Foreword Topical Special Issue on the Electrical Performance of Packages and Interconnects
Author :
Schutt-Ainé, José E.
fDate :
5/1/2007 12:00:00 AM
Abstract :
The twenty articles in this special issue focus on the electrical performance of packages and interconnects. The papers can be divided into three sections: package design and noise; macromodeling; and electromagnetic analysis.
Keywords :
Application software; Communication networks; Computer networks; Design methodology; Digital integrated circuits; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Radio frequency; Signal design;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.900164
