Title :
Advanced ceramic substrates for multichip modules with multilevel thin film interconnects
Author :
Foster, Brian C. ; Bachner, Frank J. ; Tormey, Ellen S. ; Occhionero, Mark A. ; White, Paul A.
Author_Institution :
Vitramon Inc., Bridgeport, CT, USA
fDate :
12/1/1991 12:00:00 AM
Abstract :
Two ceramic materials systems, cofired 99.6% alumina/tungsten and aluminum nitride, are presented as options for use as multichip modules bases. The 99.6% alumina system addresses the limitations of conventional 90-94% alumina systems by providing ±0.2% dimensional control combined with a smooth, defect-free surface. The 99.6% alumina/tungsten system exhibits an enhanced flexural strength. The injection-molded aluminum nitride produced using the binderless injection molding process is characterized by an average thermal conductivity of 230 W/mK with a standard deviation of 7.3. The controlled microstructure of the AlN material results in a smooth, defect-free surface after lapping and polishing for thin film compatibility. Precise dimensional tolerance control of ±0.2% for substrate features such as cavities or through holes is provided
Keywords :
alumina; aluminium compounds; ceramics; modules; packaging; scanning electron microscope examination of materials; substrates; surface topography; thermal conductivity of solids; tungsten; Al2O3-W; AlN; SEM; binderless injection molding; ceramic substrates; controlled microstructure; defect-free surface; dimensional control; dimensional tolerance control; enhanced flexural strength; lapping; multichip modules; multilevel thin film interconnects; polishing; thermal conductivity; Aluminum nitride; Ceramics; Conducting materials; Control systems; Injection molding; Microstructure; Multichip modules; Substrates; Thermal conductivity; Tungsten;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
