High density microelectronic packaging with thick film hermetic packages

Author

Lindberg, Frank A.

Author_Institution

Westinghouse Electr. Corp., Baltimore, MD, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

790

Lastpage

797

Abstract

A high-density packaging approach that uses hermetic ceramic packages made with thick film techniques has been developed. The overall approach involves building thick film chip packages, packaging and testing chips in them, and then mounting and wire bonding them on PC boards. The author describes practical aspects of this packaging approach with respect to the design and fabrication of the thick film ceramic packages, chip packaging and test using these packages, PC board design and fabrication, and PC board assembly. The issues of procurement costs, design, and fabrication cycle times, parts screening, packaging density, rework, electrical considerations, thermal performance, process maturity, and reliability are discussed

Keywords

ceramics; packaging; printed circuit design; printed circuit manufacture; reliability; thick films; PC board assembly; PC board design; PC boards; chip packaging; electrical considerations; fabrication cycle times; hermetic ceramic packages; high-density packaging; microelectronic packaging; packaging density; parts screening; procurement costs; reliability; rework; thermal performance; thick film hermetic packages; wire bonding; Assembly; Bonding; Buildings; Ceramics; Fabrication; Microelectronics; Packaging; Testing; Thick films; Wire;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105135

Filename

105135