Title :
Rudimentary Finite Element Thermal Modeling of Platelet-Filled Polymer-Ceramic Composites
Author :
Hill, Richard F. ; Strader, Jason L.
Author_Institution :
Laird Technol. Inc., Cleveland
fDate :
6/1/2007 12:00:00 AM
Abstract :
In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.
Keywords :
filled polymers; finite element analysis; integrated circuit packaging; thermal conductivity; thermal management (packaging); heat-conducting paths; platelet-filled polymer-ceramic composites; platelet-shaped fillers; polymer matrix thermal conductivity; polymers thermal performance; rudimentary finite element thermal modeling; thermal conductivity fillers; Conducting materials; Electronic packaging thermal management; Finite element methods; Polymer films; Predictive models; Temperature; Thermal conductivity; Thermal factors; Thermal loading; Thermal resistance; Composites; finite element (FE) modeling; platelets; polymers; thermal conductivity;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.898330