Title :
Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"
Author :
Kay, Robert W. ; Stoyanov, Stoyan ; Glinski, Greg P. ; Bailey, Chris ; Desmulliez, Marc P Y
fDate :
6/1/2007 12:00:00 AM
Keywords :
Assembly; Biographies; Costs; Design optimization; Microelectronics; Numerical models; Packaging; Printing; Product design; Temperature;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.895649
