Title :
Development of Ag Alloy Thin Film With Both High Reflectance and Adhesion for High Density Opt-Electronic Module
Author :
Kuroda, Akihiro ; Satoh, Ryohei ; Iwata, Yoshiharu ; Yokota, Koichi ; Fujimoto, Kozo ; Ura, Shogo ; Kintaka, Kenji
Author_Institution :
Sanyo Electr. Co. Ltd., Osaka
fDate :
6/1/2007 12:00:00 AM
Abstract :
We have developed a new multilayered reflection film structure containing Ag films for achieving slab waveguide based optical transmission interconnections between large scale integrated chips for next generation high-speed computers. We applied Cr to both adhere the Ag to the SiO2 optical layer and to inhibit diffusion of Ag into SiO2. Although we found that Cr tends to decrease the reflectance, we found that it is possible to satisfy both adhesiveness and reflectance requirements by adjusting the film thickness
Keywords :
adhesion; chromium; electroreflectance; integrated circuit packaging; modules; multilayers; optical interconnections; silicon compounds; silver; system buses; thin film circuits; waveguides; Ag; Ag alloy thin film; Cr; SiO2; adhesion; grating; high density packaging; high reflectance; optical interconnection; optoelectronic module; thermal stability; waveguide; Adhesives; Chromium; High speed optical techniques; Optical films; Optical interconnections; Optical reflection; Optical waveguides; Reflectivity; Slabs; Transistors; Adhesion; Ag reflection film; grating; high-density packaging; optical interconnection; thermal stability; waveguide;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.897974
