A process for surface texturing of Kapton polyimide to improve adhesion to metals

Author

Somasiri, Nanayakkara L D ; Zenner, Robert L D ; Houge, John C.

Author_Institution

3M Co., St. Paul, MN, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

798

Lastpage

801

Abstract

It is noted that polyimide undergoes a surface texturing process when seeded with a thin layer of copper and subjected to a high-temperature (above 400°C) treatment in air. During this heating process, copper undergoes a clustering and migration process and initiates a copper-catalyzed degradation localized around the vicinity of the cluster particles to impart a textured surface leads to improved adhesion, predominantly due to mechanical anchoring. Adhesion values of 7-10 lb/in (ambient) and 4-6 lb/in (after solder float test) have been obtained. High retention of adhesion under 85°C/85% relative humidity and 150°C aging is obtained when textured Kapton is seeded with palladium and plated with electroless nickel

Keywords

adhesion; heat treatment; packaging; polymers; surface texture; surface treatment; 150 degC; 450 degC; Cu seeding; Kapton polyimide; Pd seeding; adhesion; aging; catalyzed degradation; clustering; electroless Ni plating; high temperature treatment; mechanical anchoring; migration; solder float test; surface texturing; Adhesives; Copper; Degradation; Heating; Humidity; Lead; Polyimides; Surface texture; Surface treatment; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105136

Filename

105136