DocumentCode
888523
Title
Solutions to heavy ion induced avalanche burnout in power devices
Author
Wrobel, Theodore F. ; Beutler, David E.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
Volume
39
Issue
6
fYear
1992
fDate
12/1/1992 12:00:00 AM
Firstpage
1636
Lastpage
1641
Abstract
A review of normal breakdown and current induced avalanche (CIA) breakdown mechanisms in silicon power transistors is presented. The applicability of the CIA model to heavy ion induced burnout is shown, and solutions to CIA in silicon power semiconductors are given. It is noted that solving the problem of CIA burnout in npn bipolar and n-channel DMOS devices is, at best, difficult. Several techniques of hardening these devices to the effects of heavy ion, dose-rate induced failure, and any other condition producing CIA are discussed. The most effective techniques are those that minimize the emitter current injection by reducing the emitter injection efficiency or making the parasitic bipolar more difficult to turn on. However, it is believed that the simplest solution to the problem is to use pnp bipolar and p-channel DMOS devices whenever possible
Keywords
MOS integrated circuits; bipolar integrated circuits; bipolar transistors; impact ionisation; insulated gate field effect transistors; ion beam effects; power integrated circuits; power transistors; radiation hardening (electronics); Si devices; current induced avalanche; emitter injection efficiency; heavy ion induced avalanche burnout; n-channel DMOS devices; npn bipolar devices; power transistors; radiation hardening; Avalanche breakdown; Breakdown voltage; Charge carrier processes; Current density; Electric breakdown; Hot carriers; MOSFETs; Power transistors; Satellites; Silicon;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.211346
Filename
211346
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