Title :
Distributed Loss-Compensation Techniques for Energy-Efficient Low-Latency On-Chip Communication
Author :
Jose, Anup P. ; Shepard, Kenneth L.
Author_Institution :
Dept. of Electr. Eng., Columbia Univ., New York, NY
fDate :
6/1/2007 12:00:00 AM
Abstract :
In this paper, we describe the use of distributed loss compensation to provide nearly transmission-line behavior for long on-chip interconnects. Negative impedance converters (NICs) inserted at regular intervals along an on-chip line are shown to reduce losses from more than 1 dB/mm to less than 0.3 dB/mm at 10 GHz. Results are presented for a 14-mm 3-Gb/s on-chip double-data-rate (DDR) link in 0.18-mum CMOS technology, with a measured latency of 12.1 ps/mm and an energy consumption of less than 2 pJ/b with a BER<10-14. This constitutes a factor-of-three improvement in power and a one-and-a-half-times improvement in latency over an optimally repeated RC line of the same wire width
Keywords :
CMOS integrated circuits; integrated circuit interconnections; negative impedance convertors; transmission lines; 0.18 micron; 3 Gbit/s; 4 mm; BER; CMOS technology; distributed loss-compensation techniques; low-latency on-chip communication; negative impedance converters; on-chip double-data-rate; on-chip interconnects; transmission-line behavior; CMOS technology; Degradation; Delay; Energy efficiency; Impedance; Integrated circuit interconnections; Propagation losses; Repeaters; Transmission lines; Wire; Interconnections; on-chip networks; transmission lines;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2007.897165