Title :
Causes of cracks in SMD and type specific remedies
Author :
Omi, Susumu ; Fujita, Kazuya ; Tsuda, Takaaki ; Maeda, Takamichi
Author_Institution :
Sharp Corp., Nara, Japan
fDate :
12/1/1991 12:00:00 AM
Abstract :
Packages used with surface-mount devices (SMDs) have the unique reliability problems of package cracks arising due to soldering stress. Package cracks can be divided into three types, depending on the origin and directions of spread of the cracks. Possible causes for each type of package crack were investigated, and techniques for optimized crackproof package design for individual crack types were developed
Keywords :
reliability; soldering; surface mount technology; thermal stress cracking; SMDs; lead frame design; molding compound resistance; optimized crackproof package design; package cracks; polyimide coating; reliability; soldering stress; surface-mount devices; thermal stress; Electronics packaging; Infrared heating; Lead; Moisture; Resins; Soldering; Surface cracks; Surface resistance; Testing; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
