• DocumentCode
    889015
  • Title

    Gate size dependence of the radiation-produced changes in threshold voltage, mobility, and interface state density in bulk CMOS

  • Author

    Scarpulla, J. ; Amram, A.L. ; Gin, V.W. ; Morse, T.C. ; Nakamura, K.T.

  • Author_Institution
    Aerospace Corp., Los Angeles, CA, USA
  • Volume
    39
  • Issue
    6
  • fYear
    1992
  • fDate
    12/1/1992 12:00:00 AM
  • Firstpage
    1990
  • Lastpage
    1997
  • Abstract
    It has been observed that radiation-induced threshold voltage shifts, interface trap densities, and channel mobility reductions are dependent on the drawn or coded geometrical sizes of transistors in one radiation-hardened VLSI CMOS technology. In another technology, no such dependencies were found. The authors suggest physical mechanisms responsible for the observed size dependencies, and warn that large-area transistors and capacitors for total dose evaluations may not always be suitable. Stress measurements indicate that the radiation-induced changes are correlated with higher tensile stress levels
  • Keywords
    CMOS integrated circuits; VLSI; X-ray effects; carrier mobility; insulated gate field effect transistors; interface electron states; radiation hardening (electronics); 5 Mrad; X-ray irradiation; bulk CMOS; channel mobility reductions; gate size dependence; geometrical sizes; interface state density; radiation-hardened VLSI CMOS; radiation-produced changes; tensile stress levels; threshold voltage; transistors; CMOS technology; Capacitors; Geometry; Interface states; Length measurement; Stress measurement; Tensile stress; Testing; Threshold voltage; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.211395
  • Filename
    211395