DocumentCode :
889043
Title :
Basic Technology for VLSI (Part II)
Author :
Tarui, Yasuo
Volume :
15
Issue :
4
fYear :
1980
fDate :
8/1/1980 12:00:00 AM
Firstpage :
386
Lastpage :
396
Abstract :
This paper describes some of the recent work in the field of basic technology at VLSI Cooperative Laboratories. In microfabrication technology, a pair of high-speed electron-beam pattern delineators, electron-beam mask inspection, a pair of electron-beam projection systems, an X-ray lithography system, and electron-beam and X-ray resists are described. Thermally induced microdefects in silicon crystal are analyzed. A plasma etching system, basic testing and evacuation, and basic devices are also discussed.
Keywords :
Electron beam lithography; Electron resists; Integrated circuit technology; Integrated circuit testing; Large scale integration; Masks; Sputter etching; Etching; Inspection; Laboratories; Plasma applications; Plasma devices; Plasma x-ray sources; Resists; Silicon; Very large scale integration; X-ray lithography;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1980.1051411
Filename :
1051411
Link To Document :
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