DocumentCode
889069
Title
Trends in the total-dose response of modern bipolar transistors
Author
Nowlin, R.N. ; Enlow, E.W. ; Schrimpf, R.D. ; Combs, W.E.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume
39
Issue
6
fYear
1992
fDate
12/1/1992 12:00:00 AM
Firstpage
2026
Lastpage
2035
Abstract
The various phenomena occurring in bipolar transistors when they are exposed to ionizing radiation are discussed. NPN transistors are found to degrade more than PNP transistors. Devices with highly doped base rings will be less susceptible to total-dose damage than devices without base rings, especially in NPN devices. Devices with small emitter perimeter-to-area ratios will be less susceptible than devices with large perimeter-to-area ratios. Collector bias does not affect gain degradation. Reverse bias on the emitter is the worst-case irradiation bias condition. The increases in base current are larger at small base-emitter voltages than at large base-emitter voltages. Poly-emitter devices are initially harder than standard emitter devices, but may become worse than standard devices at large total doses. Degradation is worse at lower dose rates
Keywords
bipolar transistors; radiation effects; radiation hardening (electronics); NPN transistors; PNP transistors; bias effects; bipolar transistors; doped base rings; ionizing radiation; perimeter-to-area ratios; polarity effects; total-dose response; trench-isolated SOI transistors; BiCMOS integrated circuits; Bipolar transistors; Cranes; Degradation; Failure analysis; Ionizing radiation; Isolation technology; Leakage current; Military computing; Silicon on insulator technology;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.211400
Filename
211400
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