Insulated metal substrates for the fabrication of a half-bridge power hybrid

Author

Johnson, R. Wayne ; Thomas, Ellen L. ; Duren, Riley M. ; Curington, Donnie W. ; Lippincott, Aaron C.

Author_Institution

Dept. of Electr. Eng., Auburn Univ., AL, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

886

Lastpage

893

Abstract

Insulating metal substrates with a trilayer construction (an aluminum base plate, a thermally conductive epoxy dielectric layer, and copper conductor layer) have been evaluated for use in fabrication of power hybrid modules. Electrical (dielectric constant, dissipation factor, insulation resistance, and breakdown voltage) and mechanical (initial and aged copper adhesion, soldered adhesion, and large diameter aluminum wire bond strength) properties were evaluated. One-half of a MOSFET H-bridge, including drive circuitry, was fabricated to characterize the performance of the substrate

Keywords

hybrid integrated circuits; materials testing; packaging; power integrated circuits; substrates; Al base plate; Cu adhesion; Cu conductor layer; MOSFET H-bridge; breakdown voltage; dielectric constant; dissipation factor; drive circuitry; electrical properties; fabrication of power hybrid modules; half-bridge power hybrid; insulated metal substrates; insulation resistance; mechanical properties; soldered adhesion; thermally conductive epoxy dielectric layer; trilayer construction; wire bond strength; Adhesives; Aluminum; Conductors; Copper; Dielectric constant; Dielectric substrates; Dielectrics and electrical insulation; Fabrication; Modular construction; Thermal conductivity;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105150

Filename

105150