DocumentCode :
890909
Title :
Choice of epitaxial silicon thickness for 1.5-μm CMOS SOS circuits
Author :
Evans, I.R.
Author_Institution :
GEC Hirst Res. Centre, Wembley, UK
Volume :
36
Issue :
1
fYear :
1989
fDate :
1/1/1989 12:00:00 AM
Firstpage :
138
Lastpage :
139
Abstract :
An experimental study of the effects of epitaxial thickness on n- and p-channel silicon-on-sapphire (SOS) MOSFETs is reported. This study allows the optimum epitaxial silicon thickness for small-geometry (1-1.5 μm) transistors to be identified. Satisfactory performance of n- and p-channel MOSFETs can be obtained through the use of films 0.3-0.4 μm thick
Keywords :
CMOS integrated circuits; insulated gate field effect transistors; integrated circuit technology; semiconductor epitaxial layers; 1.5 micron; CMOS SOS circuits; SOS MOSFETs; Si-Al2O3; epitaxial thickness; n-channel MOSFETs; p-channel MOSFETs; Boron; Circuits; Fabrication; Implants; MOSFETs; Semiconductor films; Silicon; Substrates; Thin film transistors; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.21193
Filename :
21193
Link To Document :
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