Title :
On the thermal isolation applications of V-groove technology
fDate :
2/1/1982 12:00:00 AM
Abstract :
V-groove etching technology has been applied to the thermal isolation in an integrated circuit chip. Numerical calculation shows that V-groove structure brings about 50 percent improvement in normalized temperature when compared to the conventional planar structure.
Keywords :
Etching; Integrated circuit technology; Large scale integration; etching; integrated circuit technology; large scale integration; Capacitance; Circuit simulation; Heat sinks; Integrated circuit technology; Isolation technology; Oscillators; Predictive models; SPICE; Temperature; Transconductance;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1982.1051694
