DocumentCode :
892082
Title :
MOS Device and Technology Constraints in VLSI
Author :
El-Mansy, Youssef
Volume :
17
Issue :
2
fYear :
1982
fDate :
4/1/1982 12:00:00 AM
Firstpage :
197
Lastpage :
203
Abstract :
As devices and technology are scaled to achieve performance and density improvements, a number of constraints come into play. These constraints apply to both the parasitic as well as the intrinsic device and reduce the benefits that would have otherwise been available from scaling. In this paper, a number of performance limiters are pointed out. Specifically, velocity saturation, parasitic sourced-drain series resistance, finite channel thickness, and hot-carrier effects are analyzed and their effects on performance are evaluated. Future trends as impacted by these limiters are explored for both p- and n-charnel devices.
Keywords :
Field effect integrated circuits; Hot carriers; Integrated circuit technology; Large scale integration; Heat treatment; Isolation technology; MOS devices; Oxidation; Plasma applications; Silicon; Thermal stresses; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1982.1051716
Filename :
1051716
Link To Document :
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