DocumentCode :
892156
Title :
Characteristics of a Buried-Channel Graded Drain with Punchthrough Stopper (BGP) MOS Device
Author :
Sunami, Hideo ; Shimohigashi, Katsuhiro ; Hashimoto, Norikazu
Volume :
17
Issue :
2
fYear :
1982
fDate :
4/1/1982 12:00:00 AM
Firstpage :
237
Lastpage :
240
Abstract :
MOS device stuctures having a graded-drain (G), a buried-channel (B), and a punchthrough stopper (P) are realized by a tri-implantation technique without additional masking. Combined effects of B, G, and P are experimentally investigated. Significant improve ments in source-to-drain (S-D) breakdown voltage and the short-channel effect are observed in a BGP device. The BGP device structure will be durable for 5-V operation in the coming VLSI era.
Keywords :
Field effect integrated circuits; Insulated gate field effect transistors; Ion implantation; Large scale integration; Acceleration; Boron; Breakdown voltage; Circuits; MOS devices; Secondary generated hot electron injection; Stress; Temperature; Threshold voltage; Very large scale integration;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1982.1051723
Filename :
1051723
Link To Document :
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