Title :
A survey of reliability-prediction procedures for microelectronic devices
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
fDate :
3/1/1992 12:00:00 AM
Abstract :
The author reviews six current reliability prediction procedures for microelectronic devices. The device models are described and the parameters and parameter values used to calculate device failure rates are examined. The procedures are illustrated by using them to calculate the predicted failure rate for a 64 K DRAM; the resulting failure rates are compared under a variety of assumptions. The models used in the procedures are similar in form, but they give very different predicted failure rates under similar operating and environmental conditions, and they show different sensitivities to changes in conditions affecting the failure rates
Keywords :
DRAM chips; circuit reliability; failure analysis; integrated circuit testing; 64 kbit; DRAM; device models; failure rates; microelectronic devices; reliability-prediction procedures; Integrated circuit modeling; Maintenance; Microelectronics; Predictive models; Random access memory; Reliability engineering; Semiconductor device reliability; Strategic planning; Stress; Telecommunications;
Journal_Title :
Reliability, IEEE Transactions on