A novel toroidal inductor structure with through-hole vias in ground plane

Author

Phillips, Michael D. ; Settaluri, Raghu Kumar

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Oregon State Univ., Corvallis, OR, USA

Volume

54

Issue

4

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

1325

Lastpage

1330

Abstract

This paper presents a new toroidal inductor topology that can be realized in microstrip or stripline configuration. The toroidal structure comprises two sets of mutually isolated multiple-coupled lines that are connected by vias through a ground plane. This geometry facilitates a simple equivalent-circuit model for accurate analysis or synthesis of the component. A comparison between the new toroidal structure and the conventional spiral inductor topology shows good improvement in quality factor and a footprint reduction over 300%. The toroidal designs are validated by full-wave electromagnetic simulation, as well as by measurement for a two-turn toroidal inductor in microstrip configuration.

Keywords

Q-factor; equivalent circuits; inductors; interconnections; microstrip components; RF inductor; electromagnetic simulation; equivalent circuit model; footprint reduction; microstrip configuration; microwave inductor; multiple-coupled lines; planar transmission lines; quality factor; spiral inductor; stripline configuration; through-hole vias; toroidal inductor; Electromagnetic induction; Electromagnetic measurements; Geometry; Inductors; Microstrip; Q factor; Solid modeling; Spirals; Stripline; Topology; Multiple coupled lines; RF/microwave inductors; planar transmission lines;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2006.871352

Filename

1618548