DocumentCode :
894422
Title :
Investigation of short-circuit failure limited by dynamic-avalanche capability in 600-V punchthrough IGBTs
Author :
Oh, Kwang-Hoon ; Kim, Young Chul ; Lee, Kyu Hyun ; Yun, Chong Man
Author_Institution :
Device Concepts & Technol. Dev., Fairchild Semicond., Kyunggi-Do, South Korea
Volume :
6
Issue :
1
fYear :
2006
fDate :
3/1/2006 12:00:00 AM
Firstpage :
2
Lastpage :
8
Abstract :
Short-circuit-failure energy of insulated gate bipolar transistors (IGBTs) is generally known to be constant, depending on the thermal capacity of the devices. However, apart from the intrinsic thermal-failure limit, a premature short-circuit failure was observed for 600-V punchthrough (PT) IGBTs at turn-off transition. The observed failure seems irrelevant to the electrical-failure mode as well as the thermal-failure mode, rather, it depends on the dynamic-breakdown voltage of the device. In this paper, with comprehensive investigations into an instant short-circuit failure, it is shown that the observed short-circuit failure of the PT IGBTs results from insufficient avalanche capability, which is initiated by dynamic-avalanche breakdown and can severely degrade the short-circuit ruggedness of the PT IGBTs independent of the duration of the short-circuit event.
Keywords :
avalanche breakdown; insulated gate bipolar transistors; semiconductor device breakdown; semiconductor device reliability; short-circuit currents; 600 V; dynamic-avalanche breakdown; dynamic-avalanche capability; insulated gate bipolar transistors; punchthrough IGBT; short-circuit failure; thermal capacity; thermal-failure limit; Avalanche breakdown; Bipolar transistors; Circuits; Electric breakdown; Failure analysis; Insulated gate bipolar transistors; Power semiconductor switches; Temperature; Thermal degradation; Voltage; Dynamic-avalanche capability; dynamic breakdown; insulated gate bipolar transistor (IGBT); short-circuit ruggedness;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2006.870338
Filename :
1618648
Link To Document :
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