DocumentCode
894664
Title
A GaAs 1K static RAM using tungsten silicide gate self-aligned technology
Author
Yokoyama, Naoki ; Ohnishi, Toyokazu ; Onodera, Hiroyuki ; Shinoki, Touru ; Shibatomi, Akihiro ; Ishikawa, Hajime
Volume
18
Issue
5
fYear
1983
Firstpage
520
Lastpage
524
Abstract
This paper reports a GaAs 1K static RAM, fabricated using tungsten silicide gate self-aligned technology with full ion implantation. With 2-/spl mu/m gate length, an address access time of 3.6 ns and a minimum write-enable pulse width of 1.6 ns were achieved with a power dissipation of 68 mW. The access time compares favorably to those of currently reported high-speed Si bipolar memories, and the greatly decreased power dissipation is better by one order of magnitude. An address access time of 0.88 ns can be achieved by shortening the gate length to 1 /spl mu/m and adopting a 2-/spl mu/m design rule in the layout.
Keywords
Field effect integrated circuits; Gallium arsenide; III-V semiconductors; Integrated circuit technology; Integrated memory circuits; Large scale integration; Random-access storage; field effect integrated circuits; gallium arsenide; integrated circuit technology; integrated memory circuits; large scale integration; random-access storage; Annealing; Fabrication; Gallium arsenide; Logic circuits; MESFETs; Read-write memory; Schottky barriers; Silicides; Temperature; Tungsten;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1983.1051987
Filename
1051987
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