DocumentCode :
896685
Title :
Model-order reduction using variational balanced truncation with spectral shaping
Author :
Heydari, Payam ; Pedram, Massoud
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Irvine, CA, USA
Volume :
53
Issue :
4
fYear :
2006
fDate :
4/1/2006 12:00:00 AM
Firstpage :
879
Lastpage :
891
Abstract :
This paper presents a spectrally weighted balanced truncation (SBT) technique for tightly coupled integrated circuit interconnects, when the interconnect circuit parameters change as a result of statistical variations in the manufacturing process. The salient features of this algorithm are the inclusion of the parameter variation in the RLCK interconnect, the guaranteed passivity of the reduced transfer function, and the availability of provable spectrally weighted error bounds for the reduced-order system. This paper shows that the variational balanced truncation technique produces reduced systems that accurately follow the time- and frequency-domain responses of the original system when variations in the circuit parameters are taken into consideration. Experimental results show that the new variational SBT attains, in average, 30% more accuracy than the variational Krylov-subspace-based model-order reduction techniques.
Keywords :
integrated circuit design; integrated circuit interconnections; reduced order systems; transfer functions; RLCK interconnect; frequency-domain responses; interconnect circuit parameters; manufacturing process; model-order reduction; reduced-order system; spectral shaping; spectrally weighted balanced truncation; spectrally weighted error bounds; statistical variations; tightly coupled integrated circuit interconnects; time-domain responses; transfer function; variational balanced truncation; Approximation algorithms; Computational complexity; Coupling circuits; Equations; Error correction; Frequency; Integrated circuit interconnections; LAN interconnection; Reduced order systems; Transfer functions; Balanced truncation; Lur´e equations; interconnect; model-order reduction; passivity; process variation; spectral shaping;
fLanguage :
English
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
Publisher :
ieee
ISSN :
1549-8328
Type :
jour
DOI :
10.1109/TCSI.2005.859772
Filename :
1618875
Link To Document :
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