Title :
A low cost manufacturing process for high density hybrid components based on multilayer polyimide/ceramic structures
Author :
Tudanca, Manuel ; Luna, Ricardo G. ; Fraile, Aranzazu ; Triana, Javier ; Gonzalvez, Jose M. ; Vincueria, Ines ; Dominguez, Carlos F.
Author_Institution :
Dept. of Componentes y Tecnologia, Telettra Spain, Madrid, Spain
fDate :
2/1/1993 12:00:00 AM
Abstract :
The authors describe a multichip module component manufacturing process combining multilayer polyimide and multilayer low-temperature cofired ceramic structures, using the latter as the encapsulation support. A first characterization of the results is also reported
Keywords :
hybrid integrated circuits; integrated circuit manufacture; multichip modules; packaging; MLC; encapsulation support; high density hybrid components; low cost manufacturing process; low-temperature cofired ceramic; multichip module; multilayer polyimide/ceramic structures; Ceramics; Conducting materials; Conductive films; Costs; Dielectric substrates; Gold; Manufacturing processes; Multichip modules; Nonhomogeneous media; Polyimides;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
