Multimedia DTAB packages for a 125-MHz computer

Author

Kaw, Ravi ; Yanaga, David ; Matta, Farid

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

Volume

16

Issue

1

fYear

1993

fDate

2/1/1993 12:00:00 AM

Firstpage

95

Lastpage

102

Abstract

Challenges in packaging a 430-pin IC chip that operates at 2 V and draws 15 A with risetimes of about 200 ps are discussed. A highly optimized 407-pin multilayer ceramic package (PGA) with wirebonds was evaluated for this application and failed most of the noise specifications. An analysis of the failure mechanisms led to the design of a two-metal-layer 432-pin tape automated bonding (TAB) package. Performance capabilities and limitations of these two packages are compared through detailed simulations and measurements. It is concluded that TAB packages meet or exceed the performance goals for low transition times and/or large operating currents. The initial design was modified with the addition of a third metal layer. Performance results of this three-metal-layer TAB are included

Keywords

integrated circuit technology; microprocessor chips; tape automated bonding; 125 MHz; 15 A; 2 V; 200 ps; 430-pin IC chip; 432-pin; DTAB packages; large operating currents; low transition times; noise specifications; tape automated bonding; three-metal-layer TAB; two-metal-layer; Bonding; Clocks; Companies; Conducting materials; Costs; Electronics packaging; Failure analysis; Inductance; Integrated circuit packaging; Nonhomogeneous media;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.214861

Filename

214861