DocumentCode :
897170
Title :
An ATM switch hardware technologies using multichip packaging
Author :
Doi, Yukihiro ; Yamada, Hiroki ; Sasaki, Shin-ichi ; Kishimoto, Tohru ; Tomimuro, Hishashi
Author_Institution :
NTT Commun. Switching Lab., Tokyo, Japan
Volume :
16
Issue :
1
fYear :
1993
fDate :
2/1/1993 12:00:00 AM
Firstpage :
60
Lastpage :
66
Abstract :
An asynchronous transfer mode (ATM) switching system constructed of copper-polyimide multilayer multichip modules (MCMs) is described. High throughput ATM switching systems require high-speed interconnections and high-density packaging to reduce the interconnection lengths. An ATM prototype switching system which consists of two ATM switch MCMs was developed. The ATM switch MCM contains 24 LSIs and a multilayer substrate with polyimide dielectric and a fine pattern copper conductor. A fine pitch flexible lead 680-way connector was developed to achieve a high-speed interconnection between the MCM and printed circuit board. Tap automated bonding (TAB) was used to allow pretesting of the LSI devices and to mount high pin count LSI devices onto the MCM. The system performed 16×16 ATM cell switching at 150 Mb/s. Furthermore, it transmitted NRZ signals of up to 810 Mb/s between MCMs via fine-pitch flexible lead connectors and a 40-cm line in the printed circuit board
Keywords :
asynchronous transfer mode; digital communication systems; electric connectors; electronic switching systems; multichip modules; printed circuit accessories; tape automated bonding; 150 Mbit/s; 810 Mbit/s; ATM switch hardware technologies; Cu; Cu-polyimide multilayer substrate; LSI devices; MCM; PCB fine pitch connector; TAB; asynchronous transfer mode; flexible lead 680-way connector; high-density packaging; high-speed interconnections; multichip modules; multichip packaging; printed circuit board; Asynchronous transfer mode; Connectors; Dielectric substrates; Flexible printed circuits; Hardware; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Switches; Switching systems;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.214862
Filename :
214862
Link To Document :
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