A multichip package for high-speed logic die

Author

Myszka, Edward G. ; Dixon, Allison Casey ; Trent, Jim

Author_Institution

Motorola Inc., Schaumburg, IL, USA

Volume

16

Issue

1

fYear

1993

fDate

2/1/1993 12:00:00 AM

Firstpage

67

Lastpage

73

Abstract

Multichip packaging is an idea that is receiving increasing attention as electronic equipment manufacturers drive toward smaller, faster products. By connecting several chips together in a single package, board size can be reduced by up to a factor of 10 or more, and signal propagation between chips can be up to three times faster. Even so, multichip modules will only be utilized where they are the least expensive method of achieving a desired outcome. The authors discuss the required methodology and infrastructure that was developed to design, fabricate, and test a cost-effective, high-density multichip module developed to accommodate six high-speed application-specific integrated circuit (ASIC) logic devices

Keywords

application specific integrated circuits; hybrid integrated circuits; integrated circuit technology; integrated circuit testing; integrated logic circuits; multichip modules; ASIC; application-specific integrated circuit; high density MCM; high-speed logic die; multichip modules; multichip package; Application specific integrated circuits; Circuit testing; Electronic equipment manufacture; Electronics packaging; Integrated circuit testing; Joining processes; Logic devices; Logic testing; Multichip modules; Packaging machines;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.214863

Filename

214863