Title :
Defect and fault tolerant interconnection strategies for WASP devices
Author :
Hussaini, Mohammed B A ; Bolouri, Hamid ; Lea, R. Mike
Author_Institution :
Brunel Univ., Uxbridge, UK
fDate :
8/1/1995 12:00:00 AM
Abstract :
While WSI-based devices continue to be of particular interest for applications with severe performance, size, weight, power, cost, and reliability requirements, various implementation constraints in the past, including interconnect defect occurrences, have prevented their successful realization. This paper presents an investigation into defect and fault tolerant interconnect strategies for a representative WSI device, WASP (WSI Associative String Processor)
Keywords :
associative processing; fault tolerant computing; integrated circuit interconnections; integrated circuit reliability; microprocessor chips; wafer-scale integration; WASP devices; WSI associative string processor; WSI-based devices; defect tolerant interconnection; fault tolerant interconnection strategies; reliability requirements; Application software; Fault tolerance; Integrated circuit interconnections; LAN interconnection; Multiprocessor interconnection networks; Power system interconnection; Power system reliability; Prototypes; Silicon; Wafer scale integration;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on