DocumentCode :
897734
Title :
Defect and fault tolerant interconnection strategies for WASP devices
Author :
Hussaini, Mohammed B A ; Bolouri, Hamid ; Lea, R. Mike
Author_Institution :
Brunel Univ., Uxbridge, UK
Volume :
18
Issue :
3
fYear :
1995
fDate :
8/1/1995 12:00:00 AM
Firstpage :
416
Lastpage :
423
Abstract :
While WSI-based devices continue to be of particular interest for applications with severe performance, size, weight, power, cost, and reliability requirements, various implementation constraints in the past, including interconnect defect occurrences, have prevented their successful realization. This paper presents an investigation into defect and fault tolerant interconnect strategies for a representative WSI device, WASP (WSI Associative String Processor)
Keywords :
associative processing; fault tolerant computing; integrated circuit interconnections; integrated circuit reliability; microprocessor chips; wafer-scale integration; WASP devices; WSI associative string processor; WSI-based devices; defect tolerant interconnection; fault tolerant interconnection strategies; reliability requirements; Application software; Fault tolerance; Integrated circuit interconnections; LAN interconnection; Multiprocessor interconnection networks; Power system interconnection; Power system reliability; Prototypes; Silicon; Wafer scale integration;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.404097
Filename :
404097
Link To Document :
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