Metallurgical reactions at the interface of Sn/Pb solder and electroless copper-plated AlN substrate

Author

Chiou, Bi-Shiou ; Chang, Jiann-Haur ; Duh, Jenq-Gong

Author_Institution

Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

Volume

18

Issue

3

fYear

1995

fDate

8/1/1995 12:00:00 AM

Firstpage

537

Lastpage

542

Abstract

Intermetallic formation between electroless-plated copper and Sn/Pb solder is investigated. An interlayer is formed between copper and solder, and segregation of Pb-rich and Sn-rich phases are observed. X-ray diffraction and EDX analysis results suggest that the major intermetallic formed in the interlayer is Cu₆Sn₅. For the as-plated sample, the adhesion strength of Cu to the AIN substrate after 150°C aging is affected by both the recrystallization and the creep of copper. For the soldered specimen, the presence of intermetallic compound causes cracks to propagate along the intermetallic/Cu interface and results in a decrease of the adhesion strength

Keywords

X-ray chemical analysis; X-ray diffraction; ageing; aluminium compounds; ceramics; copper; cracks; lead alloys; packaging; soldering; tin alloys; 150 degC; AlN; EDX analysis; Pb-rich phase; Sn-rich phase; SnPb-Cu-AlN; X-ray diffraction; adhesion strength; aging; cracks; electroless-plated substrate; intermetallic compound; intermetallic formation; recrystallization; Adhesives; Copper; Etching; Intermetallic; Substrates; Temperature; Thermal conductivity; Thermal resistance; Tin; X-ray diffraction;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.404113

Filename

404113