Title :
Multigigabit multichannel optical interconnection modules for asynchronous transfer mode switching systems
Author :
Arai, Yoshimitsu ; Takahara, Hideyuki ; Koyabu, Kunio ; Fujita, Shuichi ; Akahori, Yuji ; Nishikido, Jun
Author_Institution :
NTT Interdisciplinary Res. Lab., Tokyo, Japan
fDate :
8/1/1995 12:00:00 AM
Abstract :
This paper describes 2.8-Gbit/s, 5-channel optical transmitter and receiver modules for board-to-board interconnection in asynchronous transfer mode (ATM) switching systems. These modules are constructed of optical and electrical submodules. The optical submodule mainly consists of a multimode-fiber array and an optical device array. The electrical submodule is constructed by a multichip module technique with GaAs IC´s and multilayer ceramic substrates. The advantage of the submodule fabric is that the submodules are independently assembled after testing. Error-free 250-m transmission is successfully demonstrated over a wide range of temperatures (from 25°C to 60°C), without automatic power control and automatic temperature control circuits in the optical transmitter module
Keywords :
asynchronous transfer mode; digital communication; electronic switching systems; integrated optoelectronics; microassembling; multichip modules; optical fibres; optical interconnections; optical receivers; optical transmitters; packaging; 2.8 Gbit/s; 25 to 60 C; 250 m; ATM switching systems; GaAs; GaAs ICs; asynchronous transfer mode; board-to-board interconnection; electrical submodule; multichannel optical interconnection modules; multichip module technique; multigigabit modules; multilayer ceramic substrates; multimode-fiber array; optical device array; optical receiver; optical transmitter; Asynchronous transfer mode; Gallium arsenide; Integrated circuit interconnections; Multichip modules; Optical arrays; Optical devices; Optical interconnections; Optical receivers; Optical transmitters; Switching systems;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on