DocumentCode :
898548
Title :
Effects of avalanche hole injection in fluorinated SiO/sub 2/ MOS capacitors
Author :
Vishnubhotla, Lakshmanna ; Ma, Tso-Ping ; Tseng, Hsing-Huang ; Tobin, Philip J.
Author_Institution :
Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
Volume :
14
Issue :
4
fYear :
1993
fDate :
4/1/1993 12:00:00 AM
Firstpage :
196
Lastpage :
198
Abstract :
Significantly improved immunity to hot-hole damage of the SiO/sub 2//Si structure is achieved by a shallow fluorine implantation into the poly-Si gate of MOS capacitors followed by a drive-in process. Compared to the nonfluorinated control, the fluorinated samples exhibit a dramatic reduction of both hole trapping probability and interface-trap generation under avalanche hole injection conditions. The degree of such an improvement increases monotonically as a function of the F implantation dose (up to 10/sup 16//cm/sup 2/). Significant decrease of the hole detrapping rate is also observed in fluorinated samples. Possible mechanisms are discussed.<>
Keywords :
fluorine; hole traps; hot carriers; impact ionisation; interface electron states; ion implantation; metal-insulator-semiconductor devices; silicon; silicon compounds; F implantation dose; MOS capacitors; SiO/sub 2/-Si:F; avalanche hole injection; drive-in process; hole detrapping rate; hole trapping probability; hot hole damage immunity; interface-trap generation; polysilicon gate; shallow implantation; Annealing; Density measurement; Doping; Electron traps; Hot carriers; Human computer interaction; Ionizing radiation; MOS capacitors; MOS devices; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.215152
Filename :
215152
Link To Document :
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