Title :
Transition Structures for 3-D Integration of Substrate Integrated Waveguide Interconnects
Author :
Suntives, Asanee ; Abhari, Ramesh
Author_Institution :
McGill Univ., Montreal
Abstract :
Two transition structures, via and aperture transitions, used for 3-D integration of substrate integrated waveguide interconnects are investigated in this letter. Equivalent circuits for both structures are presented and evaluated through parametric studies and error analysis in comparison with fullwave simulations. The models are also validated by measurements of two test-boards containing the via and aperture transitions.
Keywords :
equivalent circuits; error analysis; interconnections; waveguide transitions; 3D integration; aperture transitions; equivalent circuits; error analysis; integrated waveguide interconnects; Analytical models; Apertures; Circuit simulation; Circuit testing; Equivalent circuits; Error analysis; Integrated circuit interconnections; Integrated circuit measurements; Parametric study; Waveguide transitions; Aperture transition; modeling; substrate integrated waveguide (SIW); via transition;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2007.905592
