Title :
Power hybrids-developments in packaging technology
Author :
Newton, Paul ; Strassheim, Peter
fDate :
4/20/1989 12:00:00 AM
Abstract :
A power hybrid is any circuit solution that dissipates more than 5 W/in2 and incorporates more than one packaging technology. There are a number of developments now used in manufacturing power hybrids, and a key one is direct-bonded-copper isolation-substrate technology. The author describes this technique as well as heavy wire bonding and other techniques. The mixing of packaging technologies is discussed and the application of power hybrids to power supplies and uninterruptible power supplies is described
Keywords :
hybrid integrated circuits; lead bonding; packaging; power integrated circuits; power supplies to apparatus; uninterruptible power supplies; direct-bonded-copper isolation-substrate technology; heavy wire bonding; packaging technology; power hybrid; power supplies; uninterruptible power supplies;
Journal_Title :
IEE Review
